Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Test Chip - Definition, Design and Applications|
|Keywords: Chip, Packaging, Measurement|
|Dealing with the heat generated in today’s electronic sys-tems has gained prominence as energy usage, ecological con-cerns and the ever-present profit concerns drive industrial ac-tivities. Better heat management requires better tools to make the thermal design effort more time and cost efficient. While great advances have been made in the area of computer simulation and component measurement standardization, the hardware tools needed some improvement. One of tools, thermal test chips, has been around for a while but has limited availability, has been relatively difficult to use, and some suffered from performance characteristics that limited its usefulness. The thermal test chip discussed in this presentation addresses most of these issues.|
|Bernie Siegal, President
Thermal Engineering Associates, Inc.
Mountain View, CA