Abstract Preview

Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermally Conductive Adhesives for Electronics Applications
Keywords: Adhesives, Interface Materials, Thermal Management
Many thermal management assemblies consist of an interface material to be placed between a heat source and heat sink and a mounting device used to keep the assembly in place. The mounting device has the added purpose of applying sufficient pressure on the interface material so that interfacial thermal resistance is minimized. Thermally conductive adhesives have seen greater use in recent years as they eliminate the need for fastening devices and the application of high pressures to ensure good thermal contact. Adhesive systems can also have the added advantage of automated placement and assembly. Thermally conductive adhesives come in many varieties and it is the goal of this presentation to discuss the state of the art in adhesive technologies and give an overview of the key factors to be considered in the use of adhesives in electronics applications. Adhesive strength, application techniques, cure times and chemistries, thermal and electrical stability, and rework will all be covered. Additionally, the latest developments in activated and copolymer adhesives will be discussed.
John Timmerman, Senior R&D Engineer
Bergquist Company
Chanhassen, MN

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic