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Natural Graphite Reinforced Al and Cu Alloys with Thermal Conductivity 2 x Cu and Thermal Expansion Matched to Advanced Semiconductors
Keywords: Thermal Conductivity, Thermal Expansion, Graphite-Al and Cu
A family of high thermal conductivity thermal management materials featuring CTE matching to Si, SiC, GaAs and GaN semiconductor packages is presented. The approach features natural graphite platelet reinforced Al and Cu matrix composites formed by net-shape advanced pressure infiltration casting processes (APIC) developed by MMCC. AlGr-7 has been designed to thermal expansion match GaAs based packages and features thermal conductivity values in excess of 700 W/mK. Likewise, AlGr-4 has been designed to CTE match GaN, Si and SiC packages and features a thermal conductivity in excess of 800 W/mK. The AlGr™ materials can be hybridized with conventional MetGraf™ for a wide range of large panel thermal management solutions with high conductivity air cooled fins or embedded liquid coolant channels. Using MMCC’s “z”-insert™ technology, heat sinks and spreaders can be manufactured with up to 800 W/mK thermal conductivity in plane and ~800 W/mK through plane at locations where hot spot remediation is required. Recent studies have shown that natural graphite platelet reinforced Cu (CuGr™) materials can be manufactured with thermal conductivity values in excess of 800 W/mK with engineered CTE using similar preforming and pressure infiltration approaches used on AlGr™ products. Manufacturing cost models indicate that in production, Al matrix versions of these materials will cost less per unit volume than conventional copper heat sinks. Results of thermal modeling and examples of prototype manufacturing components will be presented.
James A. Cornie, Chairman, Chief Technology Officer
Metal Matrix Cast Composites, LLC
Waltham, MA
USA


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