Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Management System with Passive Cooling Modules|
|Keywords: thermal management, cooling, system|
|Chip-maker industry needs a temperature controllable environment for processor debugging and validating. A temperature controllable environment is created by a so-called thermal management system which comprises of four parts: a host computer, a temperature control system (TCS), a thermal head and an active heat remover (chiller, house chill water, fan etc.). As more power is exhausted on a chip, the thermal management system is required to handle up to 200 Watts/cm2 in the range of -50°C to 150°C for a chip or a processor. The high performance thermal management scheme uses a chiller or house chill water to cool the thermal head. The disadvantage of using a chiller is that the environment in a facility will have high noise when chiller(s) is in use; chiller also consumes high electrical power and needs special electrical power facility sometimes as well as occupies big space. House chill water is not always provided in many facilities. So a thermal management system without a chiller or house water is highly desirable. In this presentation, we will introduce a thermal management system which is in no needs of chiller or house chill water. The system uses liquid-air cooling modules for heat removal. The cooling module is scalable, low noise, low pressure, and low energy consumption.|
|Michael Spokoiny, CTO
United States Technology Consortium