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Thermal Management System with Passive Cooling Modules
Keywords: thermal management, cooling, system
Chip-maker industry needs a temperature controllable environment for processor debugging and validating. A temperature controllable environment is created by a so-called thermal management system which comprises of four parts: a host computer, a temperature control system (TCS), a thermal head and an active heat remover (chiller, house chill water, fan etc.). As more power is exhausted on a chip, the thermal management system is required to handle up to 200 Watts/cm2 in the range of -50C to 150C for a chip or a processor. The high performance thermal management scheme uses a chiller or house chill water to cool the thermal head. The disadvantage of using a chiller is that the environment in a facility will have high noise when chiller(s) is in use; chiller also consumes high electrical power and needs special electrical power facility sometimes as well as occupies big space. House chill water is not always provided in many facilities. So a thermal management system without a chiller or house water is highly desirable. In this presentation, we will introduce a thermal management system which is in no needs of chiller or house chill water. The system uses liquid-air cooling modules for heat removal. The cooling module is scalable, low noise, low pressure, and low energy consumption.
Michael Spokoiny, CTO
United States Technology Consortium
Chico, CA
USA


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