Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advances in Material Design and Processing for Thermal Management Solutions|
|Keywords: Thermal management, AlSiC, Metal matrix composites|
|Ever-growing demands in heat dissipation for high performance processors, memory and wireless/telecommunication systems, and future military components accelerated product development efforts in many companies. As a result of these activities, an increasing number of products has started to use production ready new and engineered materials. Insertion of these new materials into these performance driven systems started to make major contributions to improve performance and reliability. Metal matrix composites are one of the engineered materials that has started to make major contributions to improve performance and reliability in performance demanding electronic applications. Metal matrix composites such as SiC-reinforced aluminum, graphite reinforced aluminum and diamond reinforced aluminum are among these engineered materials. Designing and developing production ready metal matrix composite products will be discussed in depth in this paper. The relationship between raw materials-composite properties-product reliability will be presented. Designing a metal matrix composite first requires the selection of compatible starting components and then selection of a suitable production process which brings together these components to produce products with tailored properties. Reduced weight, high thermal conductivity and diffusivity, high stiffness, tailored coefficient of thermal expansion, tight dimensional control, reliability in various environments, and lower cost are the desired characteristics for many applications. These engineered composite characteristics are essential to provide solutions for various failure modes such as die crack, solder layer failure, and substrate crack in high performance electronic systems. This paper will discuss performance and reliability improvements in selected high performance electronic systems.|
|Birol Sonuparlak, Technical Manager