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Thermal Interface Material Market Outlook
Keywords: Thermal Interface Material, TIM, Market Outlook
Presentation will provide an overview of the global thermal interface material (TIM) market. The analysis will include a market split by major thermal interface material technology for 2007 and a forecast for 2012. A review of the major market segments expected to drive the TIM industry over the next five years will also be discussed.
Melanie Wuthenow, Consultant
Cold Spring Harbor, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic