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Competitive Advantage through Strategic System Thermal Design
Keywords: thermodynamics, cooling, power consumption
This presentation will describe the trends in thermal density in the telecom and datacom chassis world that will drive new solutions for cooling and reduced power consumption. Data center managers and equipment manufacturers alike are facing ever increasing power densities while simultaneously being required to provide more uptime using less power. Traditional cooling approaches no longer suffice. More than ever, business success is tied to strategic planning in the equipment design. The goal in equipment design is to push the limits of what is possible in terms of cooling. Attendees will take away a practical understanding of current and future cooling strategies, equipment design best practices, and industry standards. We will discuss 1. The historic and future trends in thermal density looking at metrics such as cubic inches/watt, fan air velocity, and air flow patterns. 2. How are industry standards evolving and what are the changing requirements of the data centers, the work of TGG (the green grid), virtualization and other customer driven requirements. 3. How can mechanical design and architectural chassis design deliver solutions? Some examples are airflow (optimize/increase), lowering the temperature of the air, reducing impedance, better heat sinks, using carriers to dissipate heat, evaporative cooling at the chips, localized airflow, and alternative methods of cooling.
Denise Pliskin, Networking Sales Manager
Speck Design
Palo Alto, CA

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