Here is the abstract you requested from the Thermal_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Equipment and Methodology for Consistent High Quality Stencil Printing of Phase Change Thermal Interface Material|
|Keywords: TIM, PCM, Printable|
|Phase change thermal interface materials provide excellent thermal performance and superior reliability performance. Over the last decade, phase change materials have steadily improved in thermal performance, however, applicability of these materials has remained relatively unchanged. While the traditional pad format is good for field work, it does not support high speed automation or quick adjustment in size or shape. To overcome these limitations, Honeywell recently introduced its first stencil printable phase change material, PCM45F-SP. While the stencil printable format of phase change materials overcome size and manufacturing limitations, the actual printing of these materials is not always straightforward. It can be difficult to obtain consistent results (size, thickness, and cosmetics) depending on the desired print shape and thickness as well as the properties of the part receiving the print. Fortunately, proper equipment and methodology can provide a consistent high volume process even for difficult applications. This presentation will outline the pitfalls of stencil printing, explain the root cause of common failures, and provide an in depth overview of specialized equipment and processes to provide consistent high quality printing of phase change materials.|
|Andy Delano, R&D Manager