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Transient Multiscale Thermal Modeling of Electronic Enclosures
Keywords: Multiscale Thermal Modeling, Electronic Enclosures, Compact Modeling
Thermal modeling of electronic systems such as enclosures and cabinets usually involves multiple length scales and multiple modes of heat transfer. A systematic multiscale reduced order modeling approach is developed for transient thermal and fluid analysis of electronic systems. This includes the dynamic compact models for components and dynamic reduced order model for system. This approach was illustrated through an electronic enclosure with one insulated gate bipolar transistor (IGBT) module with four embedded IGBT devices. The dynamic multi-layer compact models were developed for IGBT devices and IGBT module by combining the detailed CFD/HT simulation and R-C thermal circuit modeling. With the compact models for the IGBT devices and component, the dynamic reduced order model is developed for the electronic enclosure using the proper orthogonal decomposition (POD) reduced order modeling. An approximation error of less than 3%, 6%, and 9.8% has been achieved at the component level, module level, and system level respectively, compared to detailed CFD/HT simulations. The degrees of freedom (DOF) of numerical model have been reduced by 35% and five orders of magnitude at the component/module and system levels, respectively, while the simulation time has been reduced one and two orders of magnitude, respectively.
Qihong Nie, Graduate Research Assistant
Georgia Institute of Technology
Chandler, AZ

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic