Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bond Challenges of Stacked Dice Devices|
|Keywords: Wire bond, Stacked die, FEMA|
|The increasing use of stacked dice to enhance the volumetric functional density of IC packaging has been well accepted as enabling approach for today’s sophisticated range of personal electronic devices (PEDs). Among the various process steps in the packaging of these devices, wire bonding faces many challenges in providing critical process controls to deliver on the expectations of the industry. It applies a combination of mechanical force, ultrasonic power, and thermal energy to thin and often unsupported silicon die. This paper outlines the use of finite element in the design and development of novel stacked packages. We also show how improvements in the wire bonder are made to meet the needs of stacked die packaging.|
|Charles J. Vath, III, VP Process & Packaging Technology
ASM Technology Singapore Pte. Ltd.