Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Bondability and Reliability of X-WireTM Insulated Wire for Advanced Packaging Applications|
|Keywords: Emerging Technologies, Advanced 3D Packaging, Wirebonding|
|The electronics market demands for more functionality of electronic devices have been increasing continuously. One of driving factors is 3D packages, combining several chips. However, there are design limitations of wire bonding, which are long wires, low loop height and high I/O density with finer pad pitch. Previously, insulated bonding wire has been studied by many wire suppliers to provide flexible design rules. Recently Microbonds developed a new insulated bonding wire, called X-WireTM which is coated by a thin film insulation material. This technology is different from previous methods because there is no need for special removal of the insulation material, and it can be used with standard wire bonding systems. This suggests that many of the problems faced by current designs can be solved, and this technology can remove the bottlenecks, which currently impedes the economic viability of next-generation, high performance designs. As the name suggests, this insulated wire prevents wire short circuits even though the wires are crossed over each other and touching. In order to confirm this new technology, initial packaging feasibility is studied at STATSChipPAC which focus on wire bonding parameter window, electrical open/short verification after assembly and package reliability. Two kinds of bond wires are used for this evaluation, one is Microbond’s X-WireTM as insulated and another is normal gold wire without insulation coating. The study results show that new insulated wire is feasible for a typical packaging assembly process.|
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