Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders|
|Keywords: gold, stud, bump|
|Flip chip has the advantages of smaller footprint on the PCB, improved electrical performance, reduced manufacturing steps at assembly and excellent long term reliability. A major problem is every die is not available in a flip chip package. CVInc has processes that convert gold and copper stud bumps to flip chip bumps. Copper has been selected in the past due to embrittlement issues of Sn and Au. CVInc has developed a technique to add a barrier layer of NiAu to thick gold (including gold stud bumps) eliminating the need for copper stud bumps and providing alternatives for thick gold on traditional wire bond pads.|
|Terence Collier, President