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Wire Bonding of a RF-SOE Package using a Gold Ball Bonder
Keywords: Chain Wire Bond, Wedge Wire Bond, Ball Bond
RF-SOE power transistors are traditionally wire bonded using gold wedge bonders to create strings of loop profiles with short and long wires. A ball bond technology (chain bonding) to create a ball-loop-stitch-loop-stitch-loop-stitch is demonstrated as alternative to these traditionally wedge bond solutions. Initial chain bonding results using a ball bonder produced comparable performance as a wedge bonded product, but using more prevalent ball bonding technology. This paper will introduced the reader to the RF-SOE package wire bonding requirements then actual results achieved using chain bonding technology.
Daniel D. Evans, Jr, Senior Scientist
Palomar Technologies, Inc.
Carlsbad, CA
USA


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