Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bonding of a RF-SOE Package using a Gold Ball Bonder|
|Keywords: Chain Wire Bond, Wedge Wire Bond, Ball Bond|
|RF-SOE power transistors are traditionally wire bonded using gold wedge bonders to create strings of loop profiles with short and long wires. A ball bond technology (chain bonding) to create a ball-loop-stitch-loop-stitch-loop-stitch … is demonstrated as alternative to these traditionally wedge bond solutions. Initial chain bonding results using a ball bonder produced comparable performance as a wedge bonded product, but using more prevalent ball bonding technology. This paper will introduced the reader to the RF-SOE package wire bonding requirements then actual results achieved using chain bonding technology.|
|Daniel D. Evans, Jr, Senior Scientist
Palomar Technologies, Inc.