Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Large Diameter Wedge & PowerRibbon™ Bumping Technology|
|Keywords: PowerRibbon, Wire Bonding, Wire Wedge|
|Abstract to come.|
|Michael McKeown , Eastern Regional Sales Manager
Orthodyne Electronics Corporation