Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|The Characteristics of Copper Bonding Wire for Standard IC Package|
|Keywords: Copper, Wire Bonding, IC Package|
|The practical use of the copper bonding wire is receiving remarkable attention as an alternative material of the gold bonding wire against the background of recent sudden gold price rising up. Due to a relatively low cost of copper material compared to gold, this will allow us to greatly reduce the cost of semiconductor packages. Copper exhibits more excellent physical characteristics than gold in terms of low electrical resistivity and bond reliability, therefore copper is highly expected to be utilized in general as a bonding wire. In this report, the purity of 99.99% copper bonding wire TCA1, developed by Tanaka Electronics, will be introduced together with its features and the wirebonding evaluation result.|
|Marcus Goh , Senior Engineer
Tanaka Electronics Singapore Pte. Ltd.