Here is the abstract you requested from the wirebond_2008 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Automatic Optical Inspection of Wire Bonds|
|Keywords: Ball, Wedge, Wires|
|The presentation would cover the detection of different defect types, such as: • Ball: –Missing ball –Position on die exceeds tolerance –Shape and geometry exceed tolerance Along with soldering and gluing, IC and wire bonding belong to the most important connection technologies in electronic production. The steadily increasing quality requirements for these processing steps can only be met through 100% monitoring of the finished products. To accomplish this in a way that is objective and reliable, and that makes economic sense, automatic optical in-line inspection systems ("Bond AOIs") are more and more being used to inspect such connections.|
|Mr. Wolf Rüdiger Pennuttis , Sales Manager Business Unit NP