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Photoformable Thick Film Dielectric Process Optimization for Reduced Via Size
Keywords: photoformable thick film dielectric, Fodel®, fine vias, high density
Integration of an advanced photoformable thick film dielectric composition into a traditional thick film process enables higher density microcircuits. Here we report how 50 micron via openings are achieved using this integrated process with the aid of a novel development tool. In addition, center to center spacing between vias can be reduced beyond the capability of conventional thick film, and used where needed in the integrated multilayer circuit build. The dielectric is compatible with either silver or gold metallurgy thick film conductors. The development tool is designed to readily indicate capability during the process development phase and subsequently serve as a vehicle for process control data after the process is transferred into full scale production. This paper describes the photoformable process, materials & properties, development tool, and process optimization experimental results. Recommendations for successful process implementation are given.
Doug Link, R & D Engineer
Starkey Laboratories, Inc.
Eden Prairie, MN

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