Micross

Abstract Preview

Here is the abstract you requested from the CICMT_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Direct Write of Metals and Functional Materials for Three-Dimensional Interconnects and Antennas
Keywords: direct write, interconnect, antenna
Recent advances in nanoparticle inks have enabled inkjet printing of metal traces and interconnects with very low (100-200C) process temperatures. This has enabled integration of printable electronics such as antennas and radio frequency identification (RFID) tags with polyimide, teflon, PCBs, and other low temperature substrates. This talk will discuss three-dimensional, maskless printing of metals and dielectrics for direct-written, polymer-free conductors, RF capacitors, resistors, and interconnects, processed below 300C on non-planar substrates. CAD/CAM direct write technologies now enable printing of silver conductors on polymers at 15 micron linewidths at 3X bulk silver conductivity, as one example. We will report on RF properties of these metal traces, as well as applications of these three-dimensional, robotic printing methods for printed antennas, integrated chemical sensors, and back-end MEMS integration of novel materials. Ink design is a critical technology to enable functional direct-written components; use of nanoparticle and chemical precursors to develop low cure temperature inks will be discussed. Additionally, some hardware options for 2D and 3D printing will be presented, toward printing antennas, high density polyimide integrated circuits, RFIDs, and other integrated flexible electronics. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the USDOE under contract DE-AC04-94A185000.
Paul Clem, Senior Member of the Technical Staff
Sandia National Laboratories
Albuquerque, NM


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems