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High Aspect Patterning of Ag Fine Line by a Laser Assisted Ink-Jet Printing
Keywords: Ink Jet, Laser, Ag ink
In recent years, ink-jet (IJ) printing technique is made attention as a simple detailed wiring method for the packaging and the advanced low temperature co-fired ceramics (LTCC). However, in order to draw a practical high-density and highly integrated circuit on LTCC substrate, it is a number at the wiring width below 30um, it is necessary to deposit a several micrometers thick wiring. Furthermore, IJ nozzles are clogged in practical condition by drying of ink. The control of the surface tension of ink materials and the control of the wetting tension on the different kind substrate are important. In this research, in order to develop a laser assisted IJ on practical direct writing (MDW) technology for functional materials. By heating a substrate using laser irradiation, we controlled a spread of a droplet and improving the line width and line thickness. In this presentation, we report these influences for the three dimensions wiring using the effect of laser assisted heating in the ink-jet printing process.
Jun Akedo, Research Leader
National Institute of Advanced Industrial Science and Technology (AIST)
Tsukuba, Ibaraki 305-8564,
Japan


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