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(Ba0.6,Sr0.4)TiO3 Thick Films Deposited by Aerosol Deposition Method for Multi-Layered Capacitor Applications
Keywords: Aerosol Deposition, multi-layer structure, barium strontium titanate
The fabrication methods used in making ceramics layers as active elements in circuit components must now face the challenges associated with the tendencies of miniaturization and increased functionality shown by electronic device manufacturers. Ceramics usually requires high temperatures for sintering and this makes difficult to integrate them in dense 3D systems that contain low melting point materials, or to prevent unwanted chemical reactions, interdiffusion, shrinkage and/or alteration of the electrical properties of components already present on the fabrication board. Aerosol Deposition (AD) method is a relatively new deposition technique developed to meet the requirements imposed by the current tendencies in device manufacturing. By AD, polycrystalline thick films can be formed from ceramic powders at room temperature. Here, the advantages of powder annealing in AD are highlighted along successful integration of the AD method in multi-layered capacitor fabrication. Multi-layer structures with capacitance densities above 10nF/mm2 were successfully fabricated with voltage breakdown higher than 80V.
Daniel Popovici, Post-Doctoral Researcher
National Institute of Advanced Industrial Science and Technology (AIST)
Tsukuba, Ibaraki Pref. 305-8564,

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