Here is the abstract you requested from the CICMT_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fabrication of 6063 Al/60SiC-35Al-5Si Graded Multilayer Electronic Packaging Materials by Spark Plasma Sintering|
|Keywords: Silicon nitride, Spark Plasma Sintering (SPS), Pore Gradient Structure|
|High thermal stress will occur during fabrication and application between the two layers of 6063 aluminum alloy and 60SiC-35Al-5Si. In order to decrease the thermo stress, graded materials of Al/60SiC-35Al-5Si was fabricated by spark plasma sintering. The CTE in the graded layer was controlled by SiC content and particle sizes. The calculation results indicated that the relative stress of more than 800 MPa exist between the two layers of 6063 aluminum and 60SiC-35Al-5Si by direct compacting, but the relative stress decrease to 170 MPa or less in the graded materials. So the stability can be guaranteed in the composite. The graded layers also have the potential of high thermal conductivity, more than 180 w/mk for every layer, which is satisfied in application.|
|Lianmeng Zhang, Professor
Wuhan University of Technology
Wuhan, Hubei 430070,
P. R. China