Micross

Abstract Preview

Here is the abstract you requested from the CICMT_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Fabrication and Characteristics Dielectric Film by using Plasma Assisted Aerosol Deposition Method
Keywords: Aerosol deposition, Dielectric property, Plasma assistance
The dielectric films such as PZT and BT were formed by using the plasma assisted aerosol deposition method. We investigated that influence of plasma assistance for a deposition rate, microstructure, and the dielectric properties of the films. The deposition rate of PZT film increased while applying RF power to an ICP coil was increased. The deposition rate was approximately 1m/min. when using AD method without plasma assistance, whereas the film thickness was around about 26m/min. when using the ICP with the RF power of 800 W. Without plasma assistance, dielectric constant and loss of PZT film are about 50 and 1.6%, respectively. With plasma assistance, dielectric constant rise to about 240 while RF power is 800W. Additionally, hysteresis property improves by using plasma assistance too.
Masakazu Mori, Assistant Professor
Ryukoku University
Otsu, Siga 520-2194,
Japan


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems