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Adhesive Bonded Joints of Ceramic Fiber Composites for High Temperature
Keywords: Adhesive, Bondline thickness, Impact energy
Growing application of composite materials in airframe structure tends to make significant use of bonded constructions. In the same reference adhesively bonded joints are being increasingly used due to demand of aerospace industries. Perfect joining of different materials behaves well under fatigue loads and allows less stress concentrations. In order to see the difference in interface strength of adhesive with different materials, different high temperature materials likes C/C, C/C-SiC composites and titanium specimens were selected to characterized the performance of joints with the use of high temperature adhesive viz ceramabond 503 and phenolic resin. Bonded joints were used for the measurements of compressive strength, interface shear strength, izod and charpy impact test. The results indicate that the mechanical properties increased with the increase of bond line thickness. Also, ceramabond adhesive gives higher properties than phenolic resin. This shows that the bonded joints of C/C-SiC-C/C-SiC, C/C-SiC-C/C, C/C-C/C, C/C-SiC-titanium, C/C-titanium and titanium-titanium specimens were perfectly bonded with the ceramabond 503 and phenolic resin adhesives, which can be used for the high temperature applications. Key words: Adhesive, joints, bondline thickness, Impact energy, Mechanical properties
Dr. Vijay K. Srivastava, Professor
Banaras Hindu University
Varanasi, UP 221005,

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