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Low Cost Prototype Miniaturization by using Folded Flex
Keywords: Miniaturization, Folded-flex structure, Implantable device
The stages for manufacturing a low cost miniaturized proto device, which observes the restrictions of implantable medical devices, are presented. Our aim is to manufacture a low-cost and compact prototype of an implantable sensing device measuring electrocardiography within specifications determined by the electronics designer. The power for implant is received passively due the same magnetic field as data is transferred to the external reader device. The circuit board was folded into the final shape after components' attachment and the final result was a small-scale 3D package. In this paper, only easily attachable commercial available components are used, etching easily and in a low-cost way produces wiring of double-sided flexible printed circuit board, and 3D is utilized by folding. Obviously, by using bare chips, the final solution would be even smaller but for prototyping it is faster and cheaper to use easy acquired and attached components. In case of mass production, the whole new design, where bare chips with flip chip attachments, integrated passives, and/or stacked 3D packages with design considerations such as electrical, thermal, and mechanical engineering is justified. The manufacturing technique of the sensing device is easily adapted to other devices that need to be miniaturized. Coatings and adhesives used for electrical insulation, chemical protection, and folded structures are easily utilized in similar miniaturization prototypes.
Henna Heinil, Researcher (M.Sc.)
Tampere University of Technology, Department of Electronics
Tampere 33720,
Finland


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