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Exposing Dies for Failure Analysis in Stacked Die Packages by Micro-Abrasive Blasting
Keywords: stacked package, failure analysis, die exposing
For failure analysis in stacked packages, exposing certain dies is necessary to get access to the active Integrated Circuit (IC) structures. Decapsulation by coplanar grinding is extremely challenging and is limited by package warpage and the thinnesses of silicon dies and Die-Attach (DA) tape. The micro-abrasive blasting technique described in this paper allows fast and reliable access to the different layers of the stacked package without restrictions by package warpage or small vertical dimensions. Micro-abrasive blasting affects the moulding compound and the brittle silicon of the top die and has ablation rates for both in the same range with slightly faster removal of the moulding compound. Underlying dies are protected by the elastic DA tape, which backscatters the blasting particles. Dissolving the DA tape by chemical wet etching allows access to the undamaged underlying IC structures. Alternating micro-abrasive blasting and chemical wet etching are used for fast and efficient layer-by-layer preparation of the stacked die package.
Stefan Martens,
Infineon Technologies AG, Regensburg, Germany
Regensburg 93049,
Germany


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