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VIPOP - A Low Cost HVM POP Alternative
Keywords: Stacked, Package, Interconnection
Handheld consumer products continue to proliferate, continue to shrink, and continue to drive requirements for multiple collocated die. Stacked Package On Package (POP) products are a common solution that allows multiple devices, often with unique functionality, to share the same PCBA footprint. Existing POP solutions can have many drawbacks; proprietary designs that significantly increase packaging cost, expansion of final package footprint, exposure to high temperature processing when the packages are soldered together, and production yields that can be seriously impacted by material and process issues. The authors describe an innovative POP alternative that uses dispensed conductive adhesives as interconnections between leadless plastic packages to produce the Vertically Interconnected Package On Package. VIPOP is based upon very inexpensive, JEDEC standard designs (QFN, DFN, etc) of same or varying sizes in a vertically stacked configuration using common adhesives for mechanical attachment. Electrical interconnection between packages is enabled by recent advancements in fluid jetting techniques that allow application of conductive polymer materials to the sides and surfaces of stacked packages. VIPOP products have been demonstrated to survive lead-free SMT process temperatures and PCBA reliability testing. Use of standard packages as starting materials allows the intermixing of equivalent components from multiple sources for lowest possible final product cost or superior performance. VIPOPs can also have final footprints nearly as small as the largest die in the package, making the method very attractive from many perspectives.
Marc Robinson, CTO
Vertical Circuits, Inc.
Scotts Valley, CA

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