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Magnetic Self-Assembly of Multiple Component Types from a Heterogeneous Mixture of Parts
Keywords: magnetic self-assembly, micromagnets, embedded magnets
We report a completely parallel process for autonomous assembly of microelectronic components from a heterogeneous mixture of different component types. This method is envisioned to enable the low-cost, high-throughput assembly of multi-chip modules, stacked die assemblies, system-in-package solutions, etc. In our approach, microscale magnets are fabricated on the front or back surfaces of the silicon using a post-CMOS, wafer-level micromagnet fabrication technology [1]. Extending our previous demonstration of the magnetic self assembly (MSA) method [2], we now demonstrate MSA with bonding selectivity/specificity and the simultaneous assembly of two different component types in parallel. Unlike, previously reported self-assembly approaches [3-4] that required physical modification of the die size/shape to enable bonding specificity and were restricted to sequential steps, our method offers a completely parallel process for simultaneously assembling multiple component types. To achieve this parallel assembly, a pattern matching mechanism is used, where the intermagnetic bonding forces restrict the assembly to components only with like patterns. Here, bonding selectivity is demonstrated by assembling 1 mm x 1 mm x 0.5 mm Si blocks onto a substrate in an 8 x 8 array. The components each possess a simple square magnetic pattern, either a large square (pattern A) or small square (pattern B). The substrate possesses alternating rows of pattern A and pattern B “receptor sites.” A shaker table [2] is used to agitate the mixture of components for ordered assembly into alternating rows onto the substrate. A vibrating piezoelectric plate attached to the substrate aids in aligning the components and knocking off the incorrectly assembled components. An assembly yield (average percentage of correctly bonded parts) of 93% is achieved in about 60s. These results indicate the successful demonstration of simultaneous self-assembly of multiple types of components, a key step toward more complex directed self-assembly processes. References: [1] B. Bowers, J. Agashe, and D. P. Arnold,
Sheetal B. Shetye, Graduate Research Assistant
University of Florida
Gainesville, FL

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