Here is the abstract you requested from the DPC_2009_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Magnetic Self-Assembly of Multiple Component Types from a Heterogeneous Mixture of Parts|
|Keywords: magnetic self-assembly, micromagnets, embedded magnets|
|We report a completely parallel process for autonomous assembly of microelectronic components from a heterogeneous mixture of different component types. This method is envisioned to enable the low-cost, high-throughput assembly of multi-chip modules, stacked die assemblies, system-in-package solutions, etc. In our approach, microscale magnets are fabricated on the front or back surfaces of the silicon using a post-CMOS, wafer-level micromagnet fabrication technology . Extending our previous demonstration of the magnetic self assembly (MSA) method , we now demonstrate MSA with bonding selectivity/specificity and the simultaneous assembly of two different component types in parallel. Unlike, previously reported self-assembly approaches [3-4] that required physical modification of the die size/shape to enable bonding specificity and were restricted to sequential steps, our method offers a completely parallel process for simultaneously assembling multiple component types. To achieve this parallel assembly, a pattern matching mechanism is used, where the intermagnetic bonding forces restrict the assembly to components only with like patterns. Here, bonding selectivity is demonstrated by assembling 1 mm x 1 mm x 0.5 mm Si blocks onto a substrate in an 8 x 8 array. The components each possess a simple square magnetic pattern, either a large square (pattern A) or small square (pattern B). The substrate possesses alternating rows of pattern A and pattern B “receptor sites.” A shaker table  is used to agitate the mixture of components for ordered assembly into alternating rows onto the substrate. A vibrating piezoelectric plate attached to the substrate aids in aligning the components and knocking off the incorrectly assembled components. An assembly yield (average percentage of correctly bonded parts) of 93% is achieved in about 60s. These results indicate the successful demonstration of simultaneous self-assembly of multiple types of components, a key step toward more complex directed self-assembly processes. References:  B. Bowers, J. Agashe, and D. P. Arnold,|
|Sheetal B. Shetye, Graduate Research Assistant
University of Florida