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Microbump Creation System for 3D Advanced Packaging Applications
Today, the electronics market is faced with constant pressure from designers who want to develop “leading edge” products and customers who want more functionality in smaller packages and lower prices. This has driven the need for miniaturized 3D packages to increase portability. With this trend, came increasing I/O density and further shrinkage of the bump pitches. At the same time, the lower processing costs/die of the 300 mm wafers format has driven the need for photoresist system that not only meets the resolution requirements of the shrinking bump pitches, but is also cost effective. The uniform coatability of dry film with minimal waste in the standard wafer bumping applications in the 80 – 100+ micron heights and diameters has driven the industry interest in this alternative to liquid photoresists. Recently, DuPont Wafer Level Packaging Solutions has developed a photoresist/remover chemistry system to address the micro-bump market with a new family of dry films capable of imaging the required less than 50 micron pitch, and cleanly remove them. The focus of the presentation will be twofold. The first part will focus on the process development and characterization of the 40 micron thick DuPont MXAdvance * 140 dry film candidate with 2:1 aspect resolution ratio on a 40 micron pitch application with 30 – 40 micron high pillars/micro-bumps. The second part will review the results of the DuPont EKC162 remover tests and its impact on copper and lead free, and or solder electro-deposition processes.
Chester E. Balut, Growth Accounts Manager
DuPont Electronic Technologies
Atkinson, NH

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