Here is the abstract you requested from the DPC_2009_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Integrated Materials Enabling TSV/3D|
|Keywords: 3D, TSV, Integrated Materials|
|There is a consistence flux of miniaturization, value added functionality to IC packaging/ modules driven by a significant increase of mobile/networking products in the consumer market. The advanced packaging technologies, particularly the TSV/3D approach is driving innovative design and novel applications. One of the biggest challenges in TSV/3D packaging is integrating all of the material needed to enable TSV/3D. This paper will examine the co-designed materials from DuPont WLP Solutions, including dry film, cleaning agents, CMP slurries, passivation gasses, underfill materials, permanent coatings and adhesives.|
|Toshi Itabashi, WW Apps Eng.
DuPont WLP Solutions