Here is the abstract you requested from the DPC_2009_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Design of Tunable Filter Structures using Multilayer Low Temperature Cofired Ceramics (LTCC)|
|Keywords: LTCC, multilayer packaging, filter design|
|LTCC has emerged as an attractive packaging material for many electronic applications due to the advantages it poses in terms of cost effectiveness and functionality. This paper details the use of LTCC as an advantageous electronic packaging material. A track record of LTCC is drawn in comparison with various other packaging and substrate materials. The RF functionality of LTCC is stressed upon here. Investigations of passive multilayer filter structure using low-temperature co-fired ceramic (LTCC) for microwave-radio frequency application is done. Various switches and filters are detailed with their characteristics and applications. The critical advantages gained due to the use of LTCC are detailed here. Stress is laid upon the many novel filters and also tunable filters. Here, we develop a design for a filter structure which constitutes a planar inductor, capacitors using microstrip lines. This would be made tunable due to the advantage of LTCC multilayer design. The dispersive effects, which are generally encountered in LTCC design, which sets a limit on the maximum thickness of the substrate and the operating frequency is countered to a substantial extent with the new design. Optimization of parameters includes the right tradeoff between plate area versus number of layers for a capacitor or number of turns versus coil radius for inductors and other LTCC related variables. Design of Butterworth filters, having tunability range from a few hundred MHz to about 2.4 GHz is detailed here. The process steps in terms of standard LTCC processing parameters are detailed. Applications would be in cellular, PCS, Point to Point, Point to multipoint, satellite communications.|
|K. Suhas, Student
BMS College of Engineering
Bangalore, Karnataka 560050,