Micross

Abstract Preview

Here is the abstract you requested from the DPC_2009_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Supply Chain Activities for 3D TSV Integration
Keywords: TSV, integration, supply chain
The semiconductor industry continues to explore new and more advanced ways of integrating various electronic devices and develop packages with superior functionality and performance, reduced form factor and cost. Various approaches have been taken and several different packages are commercially available today. One of the technologies that received a lot of interest in the past couple of years has and continues to be 3D integration using through silicon via (TSV) technology. If the industry agrees that this technology is best suited to address all the technological issues facing the continuous demands for more advanced packaging solutions, there are still many concerns around implementation of this technology in the industry, due to technical challenges and especially cost. As any new technology at its beginnings, TSV also has its own challenges that will have to be addressed before it can be successfully adopted by the industry. If unit processes are already developed and available, there are still integration challenges that need to be well understood and solved. Robust and manufacturable processes, successfully integrated are critical for a smoother and faster transfer of this technology from development to production. This paper will discuss TSV technology integration within various packages and devices. The enabling technologies required for 3D Interconnect and ways of integrating them to achieve increased performance and lower costs will be discussed. Strong collaboration between equipment and material suppliers as well as technology leaders is important in solving the integration challenges and providing key solutions for cost effective and successful implementation in manufacturing. Results of such collaboration will be described.
Rozalia Beica, 3D Interconnect Director
Semitool
Kalispell, MT
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems