Abstract Preview

Here is the abstract you requested from the DPC_2009_3D technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Applications of Silicon Interposers
Keywords: silicon interposers, through silicon vias, silicon substrates
The combination of active integrated circuits with passive integrated circuits proved to be a cost-effective and reliable means to achieve high RF performance in a miniature way. SiP truly paved the way to 3D integration in the microelectronics industry, and today, many SiP modules are actual complex 3D stacks and combinations of several integrated circuits. However, we are only seeing the dawn of 3D integration, and many challenges still need to be faced, and new solutions to be found. Among these new possibilities, silicon interposers look very promising and seem to have the potential to address many of these 3D integration challenges. We will particularly emphasize through a few examples how SiP made it possible to integrate in the vertical dimension in the past in an industry limited to planar geometries so far. However, emerging needs are appearing which require the development of thinner and shorter vertical integration. The presentation will try to list exhaustively these emerging applications and needs, and we will synthesize the trends in our industry leading to the clear need for TSVs for SiP and 3D Packaging. Examples will be given how much a clear and detailed specification of these vias for each of these applications is needed so as to start the right development for the right application. Indeed, we will show that TSV is an acronym for many different technologies. But are silicon interposers the only way to 3D vertical integration? Various examples will be given of alternative technology developments throughout the industry, their advantages and disadvantages. In conclusion, the presentation will try to summarize the key success factors that silicon interposers or alternative technologies will have to find, and we will share our vision of a few application areas where we see probable value creation through silicon interposers.
Jean-Marc Yannou, Innovation Manager
NXP Semiconductors
Caen, Normandy 14079,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems