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Here is the abstract you requested from the DPC_2009_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Plasma Treatment for Improving Flip Chip Underfill Performance
Keywords: Plasma Treatment, Underfill Improvement, Increased Adhesion
Surface modification using plasma treatments is well-documented, and known for enhancing fluid flow characteristics, improving adhesion, and increasing bonding strength. Both the short-term yield and long-term reliability of underfilled flip chip devices can be improved by utilizing an optimized plasma treatment. Improvements in underfill performance can include: Improving fluid flow characteristics under the die and around the bumps, faster fluid flow (i.e. “wicking speed”), reduction or elimination of voids and air bubbles under the flip chip device, improved overall filet height, improved filet height uniformity around all edges of the die, improved adhesion of the die passivation layer to the underfill material, and improved adhesion of the interposer substrate surface to the underfill material. Data confirming underfill process improvements using plasma treatments prior to underfilling will be presented and discussed.
Scott D. Szymanski, Global Marketing Manager
March Plasma Systems
Concord, CA


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