Here is the abstract you requested from the DPC_2009_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra Fine Pitch Bumping using e-Ni/Au and Sn Lift-off Processes|
|Keywords: flip chip, lift off, Electroless nickel|
|Wafer bumping is often separated into two different categories: flip chip bumping (FC) and wafer level chip scale packaging (WLCSP). This categorization and affiliated nomenclature is partially based on the solder bump size and the type of equipment used to create the bump.|
|Andrew J.G. Strandjord , Senior Manager Advanced Packaging
PacTech Packaging Technologies
Santa Clara, CA