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The Impact of Advanced Materials on FCBGA Package Reliability and Performance Enhancement
Keywords: FCBGA, Thermal Interface Materials, Composite Lids
Flip-chip ball grid array (FCBGA) packages are currently used in a wide variety of applications including desktop computers, servers, gaming consoles and telecommunications. With the industry actively shifting towards smaller node sizes (45 nm, 32 nm etc.) and integrating multiple functionalities onto the die, the die power levels and more importantly the die heat-flux densities are drastically increasing. In order to support such high heat-flux densities, innovative solutions are imperative at all levels including the package, the PCB, and the chassis wherein the heat is finally dissipated to the ambient. There is a plethora of new high performance thermal interface materials and composite lid materials that are available in todays market. Typically, gel or grease type thermal interface materials are used for high power flip chip packages. However, gel or grease type materials are mechanically very weak. Severe pump out or dry out phenomena is observed during package level accelerated testing for gel or grease type materials. The focus of this paper is to estimate the FCBGA package thermal and mechanical reliability performance improvement that can be achieved by using these novel materials.
Sasanka Kanuparthi, Senior Engineer - Thermal Characterization
Amkor Technology
Chandler, AZ


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