Micross

Abstract Preview

Here is the abstract you requested from the DPC_2009_FlipChip technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Coreless Substrate Assembly & Reliability
Keywords: coreless, flip chip, advanced substrate
As the silicon nodes have moved to lower switching voltages the ability to maintain a clean and ample supply of current for the power planes is driving thinner cores and finer pitch substrates. The advanced build up substrates are already using 0.4mm thick cores and will be migrating to a coreless structure over the next couple of years. The reliability and assembly of these coreless substrates is quite challenging. This paper will briefly discuss the electrical drivers of coreless technology and will focus on the challenges and success of coreless substrate technology assembly and reliability.
Jon Aday, Sr. Director Flip Chip BU
Amkor Technology
Chandler, AZ


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems