Here is the abstract you requested from the DPC_2009_LED technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Practical Guidelines for Vapor Chamber Applications for Power LED and Related Device Packaging|
|Keywords: Vapor Chamber, Thermal performance, Practical Guidelines|
|Heat pipes and vapor chambers have been on the market for more than a decade. Both technologies have specific areas where application is practical and makes the best sense for a design engineer solving a thermal problem. How are these technologies different and how do they compare? This presentation will be geared for those who may not have working familiarity with the distinctions in performance, reasonable application areas, and manufacturing and assembly requirements for vapor chambers in comparison to the better-known heat pipe. Confusion over the effective conductivities of vapor chambers and heat pipes will be addressed. Published numbers for these devices tend to be quite high, >100,000w/mk, and although achievable these numbers are not what a typical thermal conductivity would be in an electronics cooling application. Thermal resistances of these devices will be broken down to where the delta-t for a given application can be estimated and from the estimated delta-t an effective thermal conductivity can be calculated. The goal of this presentation is to provide practical guidelines for application of vapor chambers in high-volume commercial applications.|
|George A. Meyer IV , Chief Operating Officer
Celsia Technologies LLC
San Jose, CA