Abstract Preview

Here is the abstract you requested from the DPC_2009_LED technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Classifying, Understanding, and Applying Thermal Interface Materials for Power LED Applications and Related Devices
Keywords: Thermal Interface Materials (TIMs), Guidelines, Power LED Applications
Thermal interface materials (TIMs) are available in hundreds of product names and types from more than one hundred vendors globally. A classification system for the major categories of materials, with a set of descriptions for performance ranges and conductivity and behavior, will be presented. Understanding test methodologies and how to interpret vendor performance data will be presented. While TIM materials appear to be a relatively insignificant material available at very low cost, performance and application requirements can have a very significant impact on total thermal resistance for a power LED module. Better understanding of how to sort out the bewildering variety of materials and terminology can assist the practical design engineer.
David L. Saums, Principal
Amesbury, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic