Here is the abstract you requested from the DPC_2009_LED technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Chip-on-Board Packaging and Thermal Solutions for 100W Single Large Area LED|
|Keywords: Chip on Board, Thermal, High Power Large LED Chip|
|Thermal challenges are now widely recognized as one of the key barriers to LED’s fast penetration to broader market. Without effective thermal management, the heat generated by high power LEDs can’t be properly dissipated resulting in higher junction temperature. This leads to reduced lumen output, change in color and forward voltage, as well as shorter life time. This paper demonstrates an effective packaging and thermal solutions for a commercial realization of a single large area LED chip of 12 mm2, with high current operation and total power as high as 100W per chip. A direct chip on board (CoB) die attach method was used to eliminate one level of interface such as existed in an SMT LED on insulated metal substrate. High thermal conductive LED submount and copper coreboard were designed for effective heat spreading without dielectric in the thermal path. The thermal resistance of the 12 mm2 LED from junction to heat sink, including core-board and associated TIM1 and TIM2 is as low as 0.7C/W. A thermal model was developed using FEA to describe the temperature at each interface, which is in agreement with measured thermal resistance data. The LED chipsets described here have been used to power the commercial 67” rear projection TVs manufactured by Samsung with no reported field failure to date.|
|Jay G. Liu, Director of Packaging Engineering
Luminus Devices, Inc.