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Benchmark Study of Metal Core Thermal Laminates
Keywords: HB-LED’s, CooLam™, Metal Core
New applications such as the use of High Brightness Light Emitting Diodes (HB-LED’s) for general lighting have brought about significant demand for thin dielectric materials laminated to metal substrates such as aluminum and copper. Conventional FR-4 printed wiring laminates have limited thermal performance due to the poor thermal conductivity. To maximize thermal performance, it is necessary to minimize the thermal resistance of the laminate structure. To accomplish this, the thermal conductivity of the dielectric must be maximized and the dielectric thickness must be minimized. To meet these thermal needs for LED applications, DuPont has developed the CooLam™ series of dielectric laminates. These materials are designed for applications requiring low thermal resistance resulting in low semiconductor junction temperature for long operating life and high reliability. This paper summarizes the results of a benchmark study comparing the thermal performance of DuPont CooLam™ and three competitive structures measuring Junction-to-Case Thermal Resistance (Čjc) and using thermal impedance as a figure of merit for comparing thermal performance of substrates, a primary metric commonly used in the LED packaging industry. To ensure uniform and unbiased results all test samples were fabricated by the same PWB fabricator and the testing was conducted by an independent laboratory. The material properties, test structures and the test method will be described in detail for five combinations of dielectric and metal substrates. Acknowledgements The testing was performed by the Industrial Technology Research Institute of Taiwan. Test samples were fabricated by MOOG Inc. The contributions of C.C. Chen who managed the overall program and Deborah Gravely who managed the preparation of the test samples are gratefully acknowledged.
Mr. Glenn E. Oliver , Design/Applications Engineer
DuPont Electronic Technologies
Research Triangle Park , NC
USA


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