Micross

Abstract Preview

Here is the abstract you requested from the DPC_2009_LED technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Management for LED Pico Projection Module
Keywords: LED, Pico Projector, Thermal
Consumers love tiny handheld electronic devices, but don't love tiny displays that show only tiny images. Pico projector is a good solution. Nowadays using LED as the lighting source is the current mainstream for Pico projectors. In this study, the high power LED has a surface area of 1mm2 with a total power consumption of 1.4W. If approximate 75% electrical power transfers to heat and radiates out from the LED chip, this contributes to a high heat flux of 105 W/cm2 within LED, which will cause high junction temperature (Tj). However the junction temperature of LED devices should be kept under 150 degree C. So the thermal design in this application is very critical. The junction temperature is 141 degree C without thermal management. After adding thermal solutions, the junction temperature decreases to 60.7 degree C, and the heat power of LED can be increased from 1.05W to 5W. In this paper, the effects on the junction temperature of different thermal solutions are investigated and compared.
Yong Chi, Senior Engineer
Hong Kong Applied Science & Technology Research Institute
Hong Kong,
China


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems