Here is the abstract you requested from the DPC_2009_Biomedical technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thin Film, Flexible Intravascular Ultrasound Catheter Device with Fine-Pitch Soldered Flip Chip Interconnect|
|Keywords: flexible electronics, flip chip on flex, ultrasound device|
|Flip chip components are mounted on a state-of-the-art circuitized flexible substrate. The assembly becomes part of an intravascular ultrasound (IVUS) catheter device that provides an ultrasound image from inside a coronary artery and is used to diagnose and assess vascular and structural heart disease. It is comprised of a miniature polyimide flexible substrate featuring extremely fine pitch circuitry, 14 micron lines and spaces, and specialized plating and metallization features to facilitate assembly and provide the highest levels of interconnect quality and reliability. The polyimide film on which the device is fabricated is 12.5 microns thick. Assembled to this flexible substrate is a PZT (receiver/transmitter), and multiple flip chip die having 22 micron bumps on a 70 micron pitch, among the finest pitched, soldered interconnect flip chips in production anywhere in the world today. Specialized fixtures and handling are required to accommodate assembly processes on the thin polymer film. A Universal Instruments Corporation GSMxs flip chip placement system is used to place die because of its capability to place parts with extremely small feature sizes, while maintaining speed and accuracy. The advanced linear motor platform utilizes high resolution cameras and advanced assembly options designed to accommodate the high quality, high yield requirements of this sophisticated manufacturing application.|
|Frank D. Egitto, R&D Manager
Endicott Interconnect Technologies, Inc.
Endicott , NY