Here is the abstract you requested from the DPC_2009_Biomedical technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Artificial Spinal Disc Incorporates Gold-on-Gold Flip-Chip Technological Approach|
|Keywords: Bio Medical , Flip-Chip, Device|
|Two technologies were evaluated when Valtronic Technologies partnered with Theken Disc, LLC to develop an artificial spinal disc, named the eDisc, to replace damaged human discs. The design of the eDisc resulted in an extensive study that compelled Valtronic Technologies (USA), Inc. to utilize a combination of solutions – the Pb-free Gold-on-Gold Flip Chip (GOG FC) and the Chip-on-Board (COB) processes as well as 0201 size surface mount technology. The resulting elastomer/metal eDisc with embedded electronics was engineered to restore the natural kinematics and dynamics of a spine motion segment and to serve as an alternative to spinal fusion procedures. Additionally, it will have the ability to monitor itself and the patient and transmit the data to a receiver via a bi-directional RF link. This presentation will discuss some of the advanced electronic packaging technology required to manufacture this and other miniaturized medical devices and sensors. The presentation will evaluate the in-vivo placement of the eDisc in a Pilot Primate program. The eDisc incorporates a 16 bit MPU; Bi-directional RF circuits; an FDA approved, rechargeable 10 year battery; battery management and generator circuitry; piezo sensors and power generators and 83 SMT passive components which are 0201 in size. In addition to the eDisc, the presentation will also illustrate a limited number of other projects that incorporate Pb-free Gold-on-Gold Flip Chip Miniaturized Medical Devices and Sensors.|
|Donald Styblo, Vice President of Technology
Valtronic Technologies (USA), Inc.