Micross

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MEMS Bonding with Polymers
Keywords: MEMS, substrate bonding, polymer bonding
Many MEMS devices use a bonding step to permanently join the active MEMS substrate to another substrate for mechanical or electrical reasons. Many materials have been evaluated as the intermediate layer to create this seal, including polymers, metal alloys and glass suspensions. For each bond, performance in key areas such as strength, resistance to environmental factors, process robustness and cost must be considered. This paper will explore the use of several polymeric adhesives and their efficacy in MEMS bonding. Among the attractive features of polymeric MEMS bonding to be explored will be the inherent compliancy of the polymers and therefore their tolerance to variations in the bonded surface, their ease of use, and their mechanical functionality. Polymer bonds will be shown to exhibit excellent compliancy over circuit topography, surface roughness and even particulates, and they are straightforward to apply by means of either spin or spray coating techniques for either a planarizing or a conformal coating. Performance of various polymers will also be shown, examining the key criteria of mechanical strength, temperature and shock resistance. Application of polymeric bonding will be explored to such devices as MEMS sensors, image sensors, and, when combined with metal diffusion bonds, 3D IC interconnects.
Kathy Cook,
SUSS MicroTec
Waterbury Center, VT
USA


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