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Laser Structured Printed Circuit Boards - Application and Characteristics
Keywords: Laser Cavity, Chip in Polymer, 3D PCB
A new developed technology allows the 3-dimensional structuring of printed circuit boards by a laser tool. Like drilling of microvias in PCBs, the material removal can be set by the structure of copper layers. So it is possible to manufacture cavities and trenches with a defined size and depth, which could be embedded inside of stack of PCB layers. Different applications are projected at present, to use such cavities for embedded active components like flip-chips. A special advantage of this technology is the high functional density of a system in board by using of the third dimension. The both surfaces of the PCB are remaining completely for the conventional SMD assembling technology. For a reliable application it is necessary to ensure the function of embedded chips and the stability of its contacts, which have to withstand the PCB lamination and all following coating, assembling and soldering processes with high thermal and mechanical stresses. All components of such a system in board are also stressed in further application by bending and thermo-mechanical mismatch between chip and substrate material. Therefore samples were tested in function and reliability. The results of reliability testing and first examples of application were also a part of this contribution.
Roland Schoenholz,
Wuerth Elektronik
Schopfheim, Baden-Wuerttemberg D-79650,

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