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Selective Heating and Cooling for Processing of Advanced PCB Assemblies
Keywords: selective heating , selective cooling, soldering technology
The thermal and mechanical sensitivity of advanced PCB assemblies, like PCB-MEMS, Electrical-Optical-Circuit-Boards, System in Board and Chip in Polymer are demanding also a further development of assembling processes. Soldering processes should allow a direct heating of the solder joints up to soldering temperature also for hidden structures and have to save sensitive components at the same time. Today this is possible only by application of sequential working selective soldering processes like hot bar soldering or laser soldering. But for a cost effective industrial application it is necessary to realize a selective and as well simultaneous soldering process, which is indeed not available at present. With special materials it is possible to realize a simultaneous selective heating, e.g. by inductive or microwave heat launching. Such heat launching materials, so-called susceptors, could be mixed with the flux into the solder pastes, so the heat is available close to the solder material. Alternatively or additionally it would be preferable to cool sensitive parts of the assembly also by the use of special heat consuming materials. Such cooling materials could be applied as a heat protection film on the surface. This contribution shows the simulation by computer modeling of such thermal effects as well as experimental results with selected materials.
Mathias Nowottnick, Professor
University of Rostock
Rostock, Mecklenburg-Vorpommern D-18059,

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