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Development of Micro/Nano-Enabled Flexible Thermal Ground Plane
Keywords: Thermal Management, Heat Pipe, Thermal Ground Plane
There have been increasing demand and challenges in thermal management as electronic system technology advances. Liquid cooling including phase-change seems to be a natural solution due to the high heat flux handling capability while significant challenge exists in liquid pumping. Heat pipes using capillary driven flow and phase change heat transfer offer a great solution in both high thermal conduction and no requirements in liquid pumping with extreme reliability. In this work, we are developing flexible thermal ground plane which operates as a conventional heat pipe while features: 1) low-cost fabrication of hybrid micro/nano-wicking structures which could significantly enhance the heat flux and thermal conductance, 2) nano-enabled highly hermetic but flexible polymer casing which could be easily integrated with print circuit board or other 3-dimensional circuits.
Y. C. Lee, Professor
University of Colorado at Boulder
Boulder, CO

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic