Here is the abstract you requested from the DPC_2009_Mems technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Micro/Nano-Enabled Flexible Thermal Ground Plane|
|Keywords: Thermal Management, Heat Pipe, Thermal Ground Plane|
|There have been increasing demand and challenges in thermal management as electronic system technology advances. Liquid cooling including phase-change seems to be a natural solution due to the high heat flux handling capability while significant challenge exists in liquid pumping. Heat pipes using capillary driven flow and phase change heat transfer offer a great solution in both high thermal conduction and no requirements in liquid pumping with extreme reliability. In this work, we are developing flexible thermal ground plane which operates as a conventional heat pipe while features: 1) low-cost fabrication of hybrid micro/nano-wicking structures which could significantly enhance the heat flux and thermal conductance, 2) nano-enabled highly hermetic but flexible polymer casing which could be easily integrated with print circuit board or other 3-dimensional circuits.|
|Y. C. Lee, Professor
University of Colorado at Boulder