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Next Generation Photoresist Removal Technology for Wafer Level Packaging
Keywords: resist, cleaning, bumping
A newly developed formulation for thick photo resist removal has been jointly developed by DuPont Wafer Level Packaging Solutions to enable high-performance wafer bumping. This paper describes the compatibility and stripping performance achieved with an innovative photoresist removal technology in various applications with both liquid and dry film photoresists. The results presented will open up new opportunities for advanced bumping applications which require pitches of 100um and below.
Cass Shang,
DuPont WLP Solutions
Hayward , CA

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