Here is the abstract you requested from the DPC_2009_Wafer technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Next Generation Photoresist Removal Technology for Wafer Level Packaging|
|Keywords: resist, cleaning, bumping|
|A newly developed formulation for thick photo resist removal has been jointly developed by DuPont Wafer Level Packaging Solutions to enable high-performance wafer bumping. This paper describes the compatibility and stripping performance achieved with an innovative photoresist removal technology in various applications with both liquid and dry film photoresists. The results presented will open up new opportunities for advanced bumping applications which require pitches of 100um and below.|
DuPont WLP Solutions
Hayward , CA