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|High Temperature Power Electronic Packaging for Oil Well Applications|
|Keywords: Packaging, SiC, Power applications|
|Silicon Carbide (SiC) devices have properties suitable for harsh environment power demanding applications in the petroleum industry. Power electronic systems for new low cost drill technology, advanced well services and completion tools and real time reservoir monitor and control functions for smart wells can be developed based on SiC components. SiC devices that can operate reliable in high temperature (HT) applications are now emerging and becoming commercially available. Lack of qualified packaging technology for combined high temperature (HT) and high power applications is however a major limitation to fully realizing the potential of SiC technology. SINTEF has in conjunction with Nordic cooperating companies initiated a new project to develop reliable packaging technology for power electronic devices to operate at junction temperatures up to 300 °C. Key issue in this project will be substrate material technology, metallization scheme together with electrical, mechanical and thermal interconnection technology. Electromigration properties, thermal induced stress capabilities, cleanliness control and system miniaturisation combined with thermal management/cooling strategy is challenges that will be addressed. Passive component selection and associate assembly technology are other challenging areas. A case study involving a 5kW motor control unit that can operate reliable at junction temperatures up to 300°C will be a main target for the selected packaging technology. The initial project plan, the partners involved and the selected case study will be presented together with interesting components, materials and processes.|
|Rolf Johannessen, Scientific Researcher
SINTEF Information and Communication Technology