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The Development and Application of 225°C Hybrid Microcircuit Technology
Keywords: High temperature electronic modules, Hybrid Microcircuit technology, DC-DC Converter
This paper presents the development and qualification of electronic module packaging technology to service the requirement for extended and reliable operation at 225 Deg.C for applications in the Oil and Gas, Automotive and Aerospace markets. It also covers the first in a range of high temperature multi chip module products that C-MAC will produce. This product being a DC-DC converter based on Cissoid’s ETNA circuit design and semiconductor components. C-MAC MicroTechnology has realised this first, high operating temperature DC-DC converter module with a high aspect ratio footprint to address the specific space envelope requirements for the increasing demands for deep well drilling in the Oil & Gas industry. The circuit is housed in a single hermetic package for mounting in a drilling tool with an inside diameter of 25-38mm. The choice of materials and the development of interconnect processes are key to the long term reliability of the product operating continuously at high temperatures and high dynamic mechanical loads. The paper will examine the steps taken firstly to evaluate a range of suitable interconnection materials adhesives and components and the subsequent process development including module assembly and hermetic sealing. Key challenges in transitioning the original PCBA design to a multi-chip module format included assessment of the smallest space envelope in which the circuit could be reliably housed, TCE management of different elements of the construction and finally, the electrical and environmental testing to ensure the resultant product would fully satisfy the environmental requirements down-hole. While this realization of the DC-DC converter is targeted specifically at the Oil & Gas drilling market, the summary will examine how the physical design may be modified for applications in the automotive and aerospace markets and key aspects of the technology which can be utilised in other circuit applications.
Bob Hunt, Head of Strategic Technologies
C-MAC MicroTechnology
Great Yarmouth, Norfolk NR30 3PX,

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